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Description: FSM 128
(FSM 128 Flatness system)
FSM 128
Stress Measurment
The FSM 128 uses a laser optical lever to measure the change of curvature
induced in a wafer due to deposited film. Pattern wafer measurment
The FSM 128 can perform non destructive measurment of pattern wafer bow fromthe front side of the
Wafer Flatness Measurment
This application allows inspection of incoming wafers to ensure they meet
wafer flatness specifications, the results quantifies and displays wafer
topography in 3D or contour mapping for identification purposes. * TEMPERATURE RANGE: ROOM TEMP
* MEASUREMENT TYPE: NON DESTRUCTIVE OPTILEVER LASER SCANNING.
* WAFER SIZE: 3" TO 8" (75mm TO 200mm), 300mm OPTIONAL.
* AUTO DUAL LASER: 750nm AND 810nm. OTHER WAVELENGTHS ARE AVAILABLE.
* AUTO CALIBRATION AND AUTOINTENSITY: INSENSITIVE TO INSTRUMENTAL DRIFT,
ENVIROMENTAL AND TEMERATURE CHANGES.
* ROTATION: MOTORIZED 0 TO 360 DEGREES FOR FAST 3D MAPPING AND LOCAL AREA
SCAN.
* MINIMUM RADIUS: 2 M
* SCAN RANGE: < 1mm TO 200mm. 300mm OPTION
* MEASUREMENT SPEED: 8 SECONDS FOR 200mm SAMPLE (8000 DATA POINTS)
* MEASUREMENT RANGE: 1 x 10(7), to 4 x 10(12) DYNE/CM(2) , WHICHEVER IS
GREATER.
* REPEATABILITY (1 SIGMA) : BETTER THAN 1.0% VARIANCE OR 4.0x10(6)
DYNES/CM(2), WHICHEVER IS GREATER.
* ACCURACY: BETTER THAN 2% USING PRECISION MIRROR OF 20M RADIUS OF CURVATURE.
* COMPLIANCE : CLASS IIIB LASER PRODUCT 21 CFR 1040
* CE MARK : COMPLY
* CLEAN ROOM COMPATIBILITY : YES
* COMPUTER : 586 PC. 3.5" FLOPPY. 1GB HARDDISK, SVGA MONITOR.
* DIMENSIONS : 14.25"(W)x20.5" (D)x15.25"(H)
* SHIPPING WEIGHT WITH PC : 125 LBS
* POWER: 110/230V, 50/60 HZ
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