Description: Fusion Ozone Asher 200AC
(Ozone Asher 200AC)
Fusion Ozone Asher 200AC
*Ozone Asher *Dry chemical ashing to remove photoresist from semiconductor substrates *No RF or uWave Plasma *Dry chemical process *Atmoshperic pressure *Infinite substrate selectivity *End point detection *Fast ashing rates *Low particulates *Single wafer operation *Cassette to cassette wafer handling 4" to 8" *Wafer capability *Modular system design *Microprocessor control *Ozone monitoring system *System self diagnostics *208V., 3Ph., 60Hz.
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